In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins.
DIPs are also used with breadboards, a temporary mounting arrangement for education, design development or device testing. Some hobbyists, for one-off construction or permanent prototyping, use point-to-point wiring with DIPs, and their appearance when physically inverted as part of this method inspires the informal term "dead bug style".